Intel is employing a new hardware security measure to mitigate the threat of physical fault injection attacks.

Upping the game for low pin count, high throughout DRAM, Infineon’s third generation HYPERRAM device doubles bandwidth to 800 MB/s in a 49-pin BGA.

New research from the Chinese Academy of Sciences may overtake Google’s 2019 claims of quantum supremacy.

MicroLED developer MICLEDI is getting even more granular with microLEDs—now, with integrated microlenses.

Learn about the Seebeck effect and how the Seebeck voltage and Seebeck coefficient come into play within the scope of thermocouples and temperature measurement.

Silanna Semiconductor unveiled a high-efficiency, single-chip USB port power supply solution that claims to reduce component count and simplify the power-sharing design in multi-port fast chargers.

InnovationLab says its additive PCB process is more energy efficient and produces less waste than traditional PCB manufacturing methods.

Learn about the need for advanced illumination before examining trends in LED performance and customizable light-emitting diode (LED) colors.

A go-ahead has been given to the CHIPS and Science Act as President Biden signed off the law on Tuesday.

Mergers and acquisitions help companies bypass the R&D stage and stay competitive. Here are some recent M&As that may accelerate electric mobility.

Catching a flight is a time-consuming process. Now, airlines are modernizing harried check-in and navigation processes to speed things up.

Summer 2022 is turning out to be a hot one for the memory industry, with not just one, not just two, but three announcements from chipmakers relating to advanced 3D NAND production.

At last, researchers and companies will have a standardized method to evaluate and benchmark new transistors.

Join your engineering community peers and take our EE Tech 2022 Global Engineering Survey. You’ll get a summary of the results once they’re released. And you’ll be entered for a chance to win an Amazon card prize!

As gallium nitride (GaN) technology gathers steam, new GaN transistor products are emerging to satisfy today’s engineering needs.

Back in 2018, MIT broke the water-air wireless communication barrier. Now, a team at KIT has transmitted messages in a novel way from the Titanic.

The new MPU family hopes to address traditional challenges in the design of HMI systems.

Learn about simplifying the mathematics of circuit analysis using the Laplace transform, Python, and SymPy using a series RLC circuit as an example.

A new wave of time-of-flight (ToF) sensors are finding use in applications such as PCs, smart door lock facial recognition, 3D image sensing, and more.

One new type of sensor and two novel automotive processing approaches might be the key to limiting traffic accidents.

Last week, Micron launched the production of a 232-layer 3D NAND. Now, SK hynix is claiming "highest 4D NAND flash" at 238 layers.