It’s the start of the holiday season and almost a new year. There’s always something to be thankful for, but here are the things we’re grateful for the most at AAC.

Bad actors soliciting communications with sensitive radio devices can lead to data breaches. Building upon machine learning techniques, IARPA launches a new program called SCISRS for real-time RF signal analysis.

Vehicles and wearables alike require increasingly precise positioning technology—and this innovation is often fine-tuned starting with GNSS receivers.

Learn about the benefits of board-mounted pressure sensors and the considerations when selecting them.

Wide bandgap materials like SiC and GaN keep finding their way into more and more devices, like Schottky barrier diodes (SBDs). Let's take a look at some recent releases and check the status of GaN SBDs.

A first in company history, Renesas is branching into FPGAs. Hoping to bypass the limitations of FPGAs, especially in IoT applications, Renesas claims its ForgeFPGAs is a low-power and low-cost solution.

With increased performance of drain-source on-state resistance, gate charge, and figures of merit, Infineon's latest 100 V MOSFET technology seeks to improve high-frequency switching applications.

The demographic of electrical engineers as of 2021 is still largely homogenous. But many companies and universities are designing programs for a more diverse pool of next-gen EEs.

In this article, find out what board mount pressure sensors are, how they work, their benefits, applications, and how to choose one for a design.

Hoping to unlock AI and 5G smartphone innovations, Micron and MediaTek, leveraging 1α node technology, have validated the next generation of memory: the LPDDR5X.

Building on year-over-year engineering advancements IBM unveils Eagle, a 127-qubit quantum processor, and the next generation of cloud-based quantum systems.

An onboard image processor from Teledyne e2v will bring deep learning capabilities to a smart nanosatellite.

Combining fuel gauge techniques in its ModelGauge m5 technology, ADI aims to improve Li-ion battery health and life with its latest battery management IC for consumer applications.

A new family of multi-cell, battery front-end ICs may speed battery development in a number of high-voltage applications—including energy storage systems, UPS, and mobility.

A new technique eliminates the limitations of shot noise on laser interferometry.

In this Industry Article, we'll discuss PoE (Power over Ethernet) standards and power sourcing equipment (PSE), using office Internet of Things (IoT) devices as an example application.

At NVIDIA's GPU Technology Conference, the company unveiled its roadmap to bring autonomy to more vehicles—dependent on chipsets, sensors, GPUs, cameras, and more.

At last week's Accelerated Data Center Premiere, AMD revealed a plethora of new processor technology including the 3rd Gen of EPYC processors (the Milan-X), the shift to 5 nm, and a Zen 4 architecture.

Distributed high-performance compute (HPC) is the cornerstone technology for climate forecasting, signal processing, and more applications. To address this, Xilinx brings forth their Alveo U55C HPC Accelerator.

STMicroelectronics aims to guarantees privacy in common near-field communication (NFC) applications such as contactless transactions, healthcare records, seamless access to digital content with new NFC tag ICs.

Manufacturers in Europe are increasing pressure on chipmakers to improve their production capacities.

This article outlines the principles of operation of optical sensors, optical sensor types, considerations for optical sensor selection, and key applications.

With advancements in materials science and electronic engineering, 3D printing is entering the stage of developing made-to-fit wearable electronic systems like that from the University of Arizona.

At this year’s Accelerated Data Center Premiere event, AMD announced a new family of accelerators, the Instinct MI200 series, that claims to literally speed up high-performance computing (HPC) in data centers.

One effective solution to the requirements of 5G technology is the use of HLC (High-layer Count) PCB boards that integrate key features such as skip vias, POVF manufacturing, advanced raw materials, and impedance control.