Tiger Lake Thin Mini-ITX SBC and COMe Module Roll

DFI announced a “TGU” line of embedded boards and systems built around Intel’s 11th Gen Tiger Lake UP3 processors with 15-28W TDPs, starting with a thin mini-ITX board and COM Express Compact Type 6 and Mini Type 10 modules. The Mini-ITX form-factor TGU171/TGU173, Compact Type 6 TGU968, and Mini Type...