Electronics, DIY, Makers, Hackers and Internet of Things (IoT)
8 years ago in News
1 day ago in News
Semicon Taiwan 2022, held this month, was an excellent gauge of where the Taiwanese semiconductor industry is and where it is going. The post A Quick Take on Semicon Taiwan 2022 appeared first on EE Times.
South Korea joins talks to discuss the formation of a “Chip 4” alliance with the U.S., Japan, and Taiwan despite concerns about a possible trade war with China. The post In a Switch, South Korea Joining Chip 4 Talks appeared...
2 days ago in News
The rollout of EV charging infrastructure in most countries is way behind the level required to serve the rapidly growing installed base of EVs. The post Global EV Charging Infrastructure Rollout: It’s Not Just About Volume! appeared first on EE...
Randhir Thakur told EE Times that IFS plans to be part of the U.S. DoD SHIP program, which will necessitate deep knowledge of GAA technology facilitating high-transistor–density 3D chips. The post Intel Foundry’s ‘No. 1’ Customer—U.S. DoD—Targets GAA appeared first...
3 days ago in News
Over the past several decades, SK hynix has grown into a semiconductor memory company specializing in DRAM and NAND products. Through multiple layers of technological innovation, the company has enabled a broad range of electronic devices and convenient services to...
New pressures are mounting for companies to accelerate convergence between IT and OT—whose work is foundational for improving manufacturing operations, according to an analyst. The post Analyst Cites New Incentives for IT/OT Convergence appeared first on EE Times.
Entering the era of foundation models will mean more reliance on pre-trained models combined with fine-tuning. The post SambaNova’s New Silicon Targets Foundation Models appeared first on EE Times.
4 days ago in News
Though chipmakers continue to announce plans to build foundries in the U.S. thanks to the CHIPS Act, the effort should go well beyond securing a domestic supply of ICs, supply chain experts predict. The post Supply Chain Experts Weigh In...
5 days ago in News
In a speech at Hot Chips, Intel CEO Pat Gelsinger predicted that package power will experience a tenfold uptick by 2030 thanks to RibbonFET, PowerVia, and high-NA EUV. The post Gelsinger Reiterates Ambitious Package Power Goal appeared first on EETimes.
Watch On-Demand Now! The EE Times Green Engineering Summit is dedicated to exploring how we can rapidly accelerate the pathway to net-zero carbon dioxide emissions. Thanks to strategies and business models related to computing, digitalization, automation, smart grid, renewable energy,...